Blazing Circuits manufactures single-sided, double-sided, and multi-layer Rigid, Flex, Rigid-Flex, and HDI PCBs.

Rigid-flex PCBs provide a simple means to integrate multiple PCB assemblies and other components including display, input or storage devices with thin, light composites that integrate wiring in thin, flexible ribbons between sections.

HDI PCBs are boards with high-density characteristics including micro-sized holes, fine lines and can be constructed with thin high performance materials, thereby enabling more interconnection functions per unit area.

HDI Structures

  • 1+N+1 – PCBs contain 1 “build-up” of high-density interconnection layers.
  • i+N+i (i≥2) – PCBs contain 2 or more “build-up” of high density interconnection layers. Microvias on different layers can be staggered or stacked. Copper filled stacked microvia structures are commonly seen in demanding designs.
  • Any Layer HDI – All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be freelyinterconnected with copper filled stacked microvia structures. This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.

Advanced Capabilities

  • Any layer HDI
  • Multilayer copper filled stacked micro via structure
  • 1.2/1.2 mil line/space
  • 3/9 mil laser via capture pad size
  • Embedded distributed and discrete passive components
  • Complex rigid-flex HDI products
  • Wide material and surface finish selections

Our Technical Proficiencies

* Multilayer up to 24+ layers
* Thorough Technical Data package review and CAM Manufacturability and Compliance review
* Wide range of laminate options including high temperature, low loss and lead-free laminates (GF, Polyimide, Rogers, Arlon, Taconic)
* Surface Finishes include Reflow Tin/Lead, Nickel, Gold, ENIG, ENIPIG, HASL, Lead-Free HASL (RoHS Compatible)
* Panel thickness up to .250″
* Panel size up to 21″x 26″
* Embedded coin, or metal core and metal backed MLB
* Mixed dielectric (hybrid) constructions
* Heavy copper (16 oz. outer layer / 8 oz.inner layer)
* Extremely Tight Line Width and Spacing Control using LDI and Precision Line Measurement CMM
* Cavity and Pocket Milling
* Prototype through mid volume production

 

PCB Technology

Standard

Advanced

Rigid-Flex & Flexible Circuits

Y

Y

Buried and Blind Vias

Y

Y

Sequential Lamination

Y

Y

Impedance Control

± 10%

± 5%

Hybrids & Mixed Dielectrics

Y

Y

Aluminum Backed PCB

Y

Y

Buried Capacitance

N

Y

PCB with Cavity

N

Y

Non-Conductive Via Fill (VIP)

Y

Y

Conductive Hole Fill

Y

Y

Depth Control Drill and Rout

Y

Y

Backdrill

Y

Y

Edge Plating

Y

Y

Etch Back

Y

Y

In-Board Beveling

Y

Y

2-D Bar Code Printing

Y

Y

Standard Features

Standard

Advanced

Maximum Layer Count

16

24+

Maximum Panel Size

18”x24”

21”x26”

Outer Layer Trace/Spacing

.005” / .005”

.003” / .003”

Inner Layer Trace/Spacing

.005” / .005”

.003” / .003”

Maximum PCB Thickness

0.250”

0.250”

Minimum PCB Thickness

.008”

.004”

Minimum Mechanical Drill Size

.008”

.004”

Maximum PCB Aspect Ratio

10:1

20:1

Maximum Copper Weight

6oz

16oz

Minimum Copper Weight

1/2oz

1/4oz

Minimum Core Thickness

0.004”

0.0015”

Minimum Dielectric Thickness

0.003”

0.002”

Minimum Pad Size Over Drill

0.018”

0.016”

Solder Mask Registration

± 0.002

± 0.0015

Minimum Solder Mask Dam

0.004”

0.0025”

Copper Feature to PCB edge

0.015”

0.010”

Tolerance on Overall Dimensions

± 0.005”

± 0.002”

 

HDI Features

Standard

Advanced

Minimum Microvia Hole Size

0.004”

0.003”

Capture Pad Size

0.010”

0.009”

Glass Reinforced Dielectrics

Y

Y

Maximum Aspect Ratio

0.7:1

1:1

Stacked Microvias

Y

Y

Copper Filled Microvias

Y

Y

Buried Filled Vias

Y

Y

Maximum No. of Buidup Layers

3+N+3

5+N+5